CMD/CSD0 pages

CMD Series
Contact Number
Contact Diameter
Current Rating
Contact Resistance
Engagement/ Withdrawal Forces
Contact Life Cycle
Dielectric Withstanding Voltage
Temperature Range
Insulation Resistance
Insulator
Contact
- Material
- Plating
Hardware
Plating Reference
42, 82, 110, 126, 158, 174, 220, 236, 316
0.6 mm nominal pin DIA
3A
5.0 mÙ maximum individual
0.6 N nominal per contact
30.000 insertion and withdrawal cycles
750 VRMS, 60 Hz - sea level
-65 °C to +125 °C
>5x103 MÙ at 500 V dc
- thermoplastic according to MIL-M-24519 Type GST 40 F; V-0/5VA per UL 94
- ESA SCC 3401 Outgassing requirements compliance
Brass & BeCu
Gold Plate
stainless steel passivated or beryllium-copper alloy nickel plated
according to MIL-DTL-55302 requirements
APRIL 2005 153
4 Contact Row High Density
Signal Connectors
• Offset-grid contact layout, four contact rows within
dielectric connector body, 1.905 mm center-to-center
contact spacing in each row and 1.905 row-to-row
spacing.
• 0.6 mm nominal pin DIA contact size; 42 to 316
contact positions; dip solder and SMT soldering
contact termination types.
• High contact density, low connector weight, low
mating force. High shock and vibration proof (no
micro interruptions - test: 2ns).
• Conforms to MIL-DTL-55302 general requirements,
and TPR 02013. CSD conforms to ESA specification.
• For Civil, Military, Aerospace and Space applications.
Technical Characteristics