PSX8000 pages
Panasonic ,c
nnnnideas for life
nnnn2011
nnnnAssembly System
nnnncatalog
nnnnPlasma Dicer
nnnn• Ability to dice very thin wafers without causing damage
nnnn• Chips with excellent fracture toughness
nnnn•Suitable for a wide range of applications
nnnnModel ID | PSX800 |
Model No. | NM-EFP2A |
Plasma Source | ICP plasma |
Process Gas | Maximum of five systems (e.g. Fluoride Gas, 02, He) |
Applicable Wafer | 0 200 mm wafer with protective tape, 0 300 mm wafer with protective tape, 0 300 mm wafer with dicing ring |
Wafer Thickness | Min. of 25 pm - Max. of 750 urn |
Machine Dimensions | W750mmxD1 990mm,H1 950 |
Weight | 2 000 kg (machine only) |
Power Source | Single phase AC 200 V, 5 k VA and three-phase AC 200 V, 5 k VA |
Pneumatic Source | 0.49 MPa or larger, 6.5 L / min [A.N.R.] |
N2 Source | 0.15 MPa to 0.2 Mpa, 20 L/min |
* For details, please refer to the specifications.
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