AF 32® eco Thin Glass0 pages
AF 32® Thin Glass
Product Information
AF 32® eco is an alkali-free flat glass produced by a SCHOTT
specific down-draw echnology, enabling production in a
t
t
hickness ange from 0.03 mm to 1.1 mm.
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Its fire-polished surface results in a low roughness value.
The coefficient of thermal expansion of AF 32® eco matches
silicon, therefore it is the perfect choice as ptical ackaging
o
p
material in emiconductor related pplications. Due to its
s
a
high transformation temperature it can be used for high
temperature applications up to pprox. 600 °C.
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AF 32® eco is available in wafer format and is anufactured
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with eco-friendly refining agents.
Applications
Wafer Level Chip Size Packaging
•t oefficient of thermal expansion match to silicon
C
•t High transmittance
•t arge sheet format suitable for 12-inch wafers
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MEMS
•t oefficient of thermal expansion match to silicon
C
•t ow roughness due to fire-polished surface
L
Wafer Level Chip Size Packaging
MEMS
Wafer Level Optics
•t oefficient of thermal expansion matches
C
•t Silicon
•t High transmittance
•t everal thicknesses available
S
•t Tight thickness control
•t asy to dice by diamond saw
E
Technical Data
round and square custom size wafer formats, e.g. 6”, 8” or 12”
Surface roughness
< 1 nm RMS
Thicknesses
0.03 mm up to 1.1 mm
Standard thicknesses
0,3 mm, 0,4 mm
Luminous transmittance τvD65 (d = 0.5 mm)
91.9 %
Coefficient of mean linear thermal expansion α (20 °C; 300 °C)
(static measurement)
3.2 ⋅ 10 –6 K–1
Transformation temperature Tg
717 °C
Dielectric constant εr at 1MHz
5.1
Refractive index nD
1.5099
Density ρ (annealed at 40 °C/h)
2.43 g/cm3
Advanced Optics
SCHOTT AG
Hattenbergstrasse 10
55122 Mainz
Germany
Phone +49 (0)6131/66-1812
Fax +49 (0)3641/2888-9047
info.optics@schott.com
www.schott.com/advanced_optics
Version May 2013
Dimensions
"