S-3 HDI? Yarn0 pages

PRODUCT INFORMATION

agy
in materials

S-3 HDI™ Yarn
Low CTE, High Modulus Glass Fiber Yarn
for IC Substrate PCB Applications

AGY’s S-3 HDI™ yarns are specically
designed to meet the demanding
performance requirements of IC
substrate PCBs.
Product Application
The use of smartphones and tablet
PCs continues to grow globally. In
addition, the functionality of these
devices continues to increase, which
has created the need for smaller and
highly specialized PCBs. IC substrates
are utilized as the connection
between the IC chips and the PCB,
and represent state-of-the-art
miniaturization in PCB design. Often
referred to as chip scale package,
package-on-package, or multi-chip
package solutions, these PCBs are
routinely found in smartphones and
tablet PCs.
Product Description
S-3 HDI yarns are produced using a
proprietary, patent pending glass

Features

Benets

CTE = 3.5 ppm/OC vs. 5.4 ppm/OC for
E-Glass

Minimizes CTE mismatch with
silicon chips, improving
substrate reliability

Tensile Modulus = 86 GPa vs. 72 GPa
for E-Glass

Enables thin substrates with
minimum warpage at elevated
temperatures

Low hollow bers

Excellent conductive anodic
lamentation (CAF) resistance

Wide range of ber micronage and
yield/tex

Wide range of possible
substrate thicknesses

Highly homogeneous glass quality

Consistent performance in PCB
applications

Treated with electronics grade starch/
oil sizing

Fabric surface smoothness with
high-speed air-jet weaving

composition designed for the specic
requirements of low coefcient of
thermal expansion (CTE) and high
tensile modulus. S-3 HDI yarns are
available in a wide range of ber
micronage and yield/tex, including
ultra-ne yarns for the thinnest
substrates.