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Thermal Shock Chambers0 pages
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| I enney Thermal Shook Chambers |
| Thermal Shook Chambers Designed primarily to meet the requirements of MIL-STD 883, Method 1010 and MIL-STD 202, Method 107, temperature cycling and thermal shock respectively, these chambers test the resistance of electronic components and assemblies to sudden and severe temperature changes. In addition to the popularly-sized 2 cubic foot and 8 cubic foot units, Tenney offers the T-Shock Junior, a bench-top thermal shock chamber with a V cubic foot carriage capacity. Designed to accommodate pilot runs and the smaller production quantities of sophisticated discrete components, the T-Shock Junior is an efficient, cost-effective alternative to larger capacity units. |
| www.thermalproductsolutions.com |
