EDA 3D Analysis Suite0 pages

Product Highlights
.. Component for rapid implementation of
3D analysis and visualization
.. Robust 3D modeling for both simple and
complex forms
.. Flexible meshing tools for a wide range
of solver applications
.. Advanced visualization for complex
multi-layer designs
.. Object oriented C++ software toolkit
DATA SHEET
www.spatial.com
Product Overview
The EDA 3D Analysis Suite enables
rapid development of 3D analysis and
visualization features within current
EDA physical design fl ows. The software
component suite provides unique
productivity and time-to-market (TTM)
advances to tool developers, including
3D model creation from industry
standard design data, interrogation,
meshing, and visualization that brings
signifi cant advantages to all aspects of
electronic design—on-chip, packaging,
and PCB. This extensible 3D technology
is readily integrated into applications
via a set of robust APIs to enhance 3D
functionality of existing EDA tools to form
the basis of entirely new applications that
serve emerging markets.
Integrating with your application the EDA
3D Analysis Suite provides all the preprocessing
and visualization necessary to
link your 2D application to your 2.5D and/
or 3D proprietary solver capability (Figure
1). The suite consists of a 3D modeler, a
mesher subsystem that includes utilities
to implement adaptive meshing, and
a graphics display that is integrated
and accessible through a unifi ed API to
streamline developer learning curves and
accelerate development time.
ACIS Inside
The fully functional modeler supplied
within the suite enables creation of
3D models via data read from your
application’s IC layout and technology fi le
information, or package and PCB layout.
The modeler supports the following
classes of EDA applications:
RF Design and Analysis
.. On-chip embedded passive
components
.. Full 3D modeling for simulationbased
extraction
Parasitic Extraction
.. Victim – Aggressor analysis Cell
Design
.. Characterization of 3D eff ects for
thermal and signal integrity
modeling
.. Manufacturing variations (modeling
CMP, etch, diff usion variations)
System-in-Package
.. Multi-chip-module
.. Multi-die packages
.. Die-to-Package and package-toboard
3D modeling
Stacked Die (Through Silicon Vias)
.. Complex multi-layer 3D modeling
.. Non-rectilinear shapes
.. High capacity
TCAD
.. Device level modeling and meshing
.. Interconnect modeling
.. Complex physical profi les
Meshing
The EDA 3D Analysis Suite off ers both
pre and post-processing for 2D and
3D solvers:
.. Advanced meshing capabilities
integrated with the 3D model
.. 2D surface and 3D volumetric
meshing
.. Automatic meshing with a rich set of
refi nement options
.. Support for anisotropic elements
.. Adaptive meshing utilities
The Mesher Subsystem Includes:
Surface Meshing
.. Triangular elements
.. Quadratic elements
Volumetric Meshing
.. Tetrahedral elements
Meshing Controls
.. Anisotropic
.. Mapped (geometrically regular)
.. Adaptive
Advanced Graphics
The resulting 3D models are visualized
using a high-performance, multiplatform
graphics engine. The state-ofthe-
art visualization engine provides
extreme capacity and advanced features
like colors, shading, textures, refl ectivity,
and adjustable cutting planes.
EDA 3D Analysis Suite