Low Concentration Zirconia Oxygen Analyzer0 pages
General Model 0X400
Specifications knaiyCzern,ra,ion Zirc°nia °xy9en C €
Analyzer
GS 11M10B01-01E
The OX400 is a highly accurate and reliable low-con-
centration zirconia oxygen analyzer that is capable of
measuring a wide range of concentrations, from 0-10
ppm up to 0-100 vol% 02. This is the latest oxygen
analyzer from Yokogawa, and its development was
based on the company's long experience and strong
track record with this technology.
A proprietary new thin-film deposition technology was
used in the zirconia sensor that creates a molecular
bond between the zirconia element and the platinum
layer. This prevents separation, enables a reduction in
sensor size and ensures a high-speed response and
long life.
The OX400 can be used to control and monitor various
semiconductor applications, and to control environ-
ment, air leakage into inert gas, and other processes.
Features
Long life and high-speed response
• Thanks to the use of Yokogawa's proprietary new
thin-film deposition technology, the sensor has three
times the lifespan of those used in our earlier prod-
ucts.
• A cylindrical sensor design facilitates the replacement
of measurement gases, thereby helping to assure a
high-speed response.
High performance and high reliability
• Superior repeatability and linearity even at low oxy-
gen concentrations
• Either pump or aspirator sampling can be selected,
depending on the application.
• CE, C-tick, cCSAus certification.
Built-in functions and a variety of self-diagnosis
functions
• Comes with multi selector, auto range, partial range,
and pump on/off functions
• A variety of self-diagnosis functions are provided that
detect malfunctions such as heater temperature error,
temperature sensor burnout, and sensor resistance
value error.
Superior maintainability
• The sensor can be replaced on-site.
• Compact and lightweight for easy installation.
Applications
• Oxygen concentration control in semiconductor-relat-
ed diffusion and drying furnaces and in LCD manu-
facturing processes
• Oxygen concentration control in solder pot flow and
re-flow ovens, and glove boxes used in electronics
manufacturing, and in gas production processes
• Oxygen concentration measurements to prevent dust
explosions during powder transfer
« I ^ iii • •« Yokogawa Electric Corporation GS 11M10B01-01E
Yl)Kl)Cji\\A//\ 2-9-32, Nakacho, Musashino-shi, Tokyo, 180-8750 Japan ©Copyright Jun. 2009
1 XV"^ ▼ Tel.: 81-422-52-5617 Fax.: 81-422-52-6792 1st Edition Jun. 2009
3rd Edition Mar. 2011
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