Cooler Than Ever: Heat-Curing Adhesives0 pages

Low-tension bonding of
temperature-sensitive components
for compact cameras

Cooler Than Ever:
Heat-Curing
Heat Curing Adhesives
Low-tension curing at +60 °C
DELO has developed specialized DELOMONOPOX LT2xx
adhesives for temperature-sensitive components.
These products achieve full strength when cured at just
+60 °C.

Heat-curing adhesives are used for many applications
requiring high strength and permanent chemical and
environmental resistance. To achieve these properties,
most adhesives must be cured at temperatures between
+100 °C and +150 °C – but not DELO’s adhesives.
*

LT = Low Temperature

Application areas

Customer’s benefits

Low-tension bonding and casting of temperaturesensitive materials in the following sectors and many
more:
Compact camera modules (CCM)
Electronic assembly
Mobile assembly
Optical packaging (including infrared LEDs,
image sensors)

Used in applications requiring high precision:
Extremely low warpage due to low heat input
Low thermal stress enables the use of cost-efcient
substrates
High efciency due to low energy consumption
during heat curing

Optical packaging –
Bonding of housing to PCB and glass cover to housing

Product properties
One-component, modied epoxy resins, solvent-free
Low curing temperature: +60 °C
Dispensing of very ne structures with standard
dispensing needles (for example, 200 µm dia.)
Excellent adhesion to many plastics (such as ABS,
LCP, PA, PBT, PMMA, PPS), metals and FR4
High strength and permanent environmental
resistance