DUAL COOL PACKAGE POWERTRENCH® MOSFET0 pages
DUAL COOL PACKAGE POWERTRENCH® MOSFET
Dual CoolTM packaging technology, provides both bottom and top-side
cooling in a PQFN package. Not only is the PQFN footprint an industry
standard, it provides the designer with performance exibility. With
enhanced dual path thermal performance and improved parasitics
over its wire-bonded predecessors, the use of a heat sink with Dual
Cool packaging technology provides even more impressive results. Test
results prove that, when a heat sink is used with our Dual Cool package
technology, synchronous buck converters deliver higher output current
and increased power density. With Fairchild’s trench silicon technology,
Dual Cool packaging technology proves to be a clear leader in power
density and thermal performance. Our Dual Cool package solutions are
lead free and RoHS compliant and are available in 3.3mm x 3.3mm and
5mm x 6mm PQFN packages.
3.3mm x 3.3mm &
5mm x 6mm
Top
Bottom
Features
Maximum Power Dissipation
•t Top-side cooling, lower thermal resistance from junction to top
•t Same land pattern as 5mm x 6mm and 3.3mm x 3.3mm
PQFN – JEDEC standard
Capable of >60% Better Thermal Performance
Dual Cool Package
3.3mm x 3.3mm
Air Flow =
200LFM
•t Allows higher current and power dissipation
•t Highest power density for DC-DC applications
•t Use with or without a heat sink, reduces the number of qualied
components in the BOM
Standard PQFN
No Air Flow
3.3mm x 3.3mm
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Power Loss (W) TJ Max. = 90°C, Ta =50°C
•t Multiple suppliers without cross licensing requirements
•t High degree of production commonality with standard
PQFN packaging
•t 25V - 150V portfolio
Applications
•t Point-of-Load (POL) synchronous-buck conversion
•t Servers
5mm x 6mm Package
Interconnect
QJA(°C/W)
(%) Improvement from
Wire Package
PQFN Wire
27.1
-
PQFN Clip
23.8
13.9
Dual Cool Package
17.2
57.5
•t Telecommunications, routing and switching
•t Heat path from top only
Environment: Minimum Pad, Heat Sink, 200LFM Forced Air
fairchildsemi.com
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