AirMax® High Speed Family0 pages

BACKPLANE CONNECTORS

AirMax® HIGH SPEED
PRODUCT FAMILY
Scalable performance to 25Gb/s
OVERVIEW
AirMax® family of connectors address the industry needs
for high bandwidth applications requiring a scalable
migration path to 25Gb/s data rate. This innovative edgecoupled connector utilizes a shieldless design with an
air dielectric between conductors. AirMax® technology
delivers signal densities up to 63.5 differential pairs per
inch while exhibiting low insertion loss and low crosstalk,
allowing signals to scale differential signals up to 25Gb/s.
Breaking the dependence on metal shields to accomplish
excellent high speed electrical performance also provides
incredible design flexibility. Individual contacts in a
connector module are able to be allocated to differential
signal pairs, single-ended signals or low-level power as
dictated by the system need. The standard 2.0mm column
spacing can be easily increased to 3.0mm enabling signal
traces to be routed on a board layer, trading some signal
density for reduced layer count and lower board cost for
those applications that do not demand maximum signal
density. The AirMax ® system also provides flexibility in the
number of differential pairs per column to address card
slot pitch, connector profile or airflow requirements.
AirMax® extensive product variations accommodate a wide
range of industry standard applications commonly used
in backplane, midplane, coplanar, mezzanine, Cable-ToBoard, and orthogonal midplane architectures.

FEATURES

BENEFITS

•t Provides a scalable migration path to 25Gb/s per
differential pair

•t Scalable system architecture without costly redesign

•t Innovative shieldless edge couple technology and air
dielectric between adjacent conductors

•t Superior electrical performance delivering low crosstalk
and insertion loss

•t Open Pin field design

•t Maximizes pin assignment flexibility

•t Backward mating-compatible interface

•t Enables easy migration path to previous generation
systems

•t Hard metric design

•t Flexible design for low speed signals, power and guidance
components.

•t 3.0mm column pitch for Quad PCB routing

•t Reduces PCB layer count via quad routing the signal
tracess

•t Contains no interleaving shieldst

•t Reduces connector cost, weight, and PCB routing complexity