GIG-Array0 pages
BOARD TO BOARD CONNECTORS
GIG-ARRAY® CONNECTOR SYSTEM
DESCRIPTION
The GIG-ARRAY® connector is designed to meet the
needs of up to 10Gb/s applications requiring up to 296
signal pins per connector. FCI’s long tradition as a BGA
connector innovator assures expertise and reliability in the
GIG-ARRAY® BGA design. The combination of multiple
stack heights (15mm to 40mm) and multiple sizes (200
signals to 296 signals) utilizing a 100-Ohm differential
matched impedance design allows for optimal design flexibility while yielding less than 1% cross-talk performance.
FCI has produced BGA mezzanine connectors since
1996, shipping over 10 billion BGA contact interfaces
demonstrating FCI’s extensive experience as the premier
BGA interconnect innovator and supplier. FCI’s patented
BGA design is supported by fully automated quality
control systems featuring 100% inspections of assembly
coplanarity, solder sphere size and location, as well as
critical-to-function terminal component attributes. Multiple
in-line vision systems, quality control product audits, and
statistical process controls are all a part of our state-ofthe-art manufacturing facility.
FEATURES & BENEFITS
oHS compliant (Lead-Free) options are available
R
TARGET MARKETS / APPLICATIONS
Communications
t • Transmission
ptimized design for utilization in high-density, high-speed mezzanine
O
tt • Access
applications
tt • Switching
all Grid Array (BGA) termination for process friendly attachment
B
tt • Optics
mm x 0.65mm BGA interface pitch optimizes routing and electrical performance
1
tt • Networking
tack Heights available from 15mm to 40mm provide mezzanine design
S
Data
flexibility
t • Servers
onnector sizes of 200 and 296 signals providing 62 signal contacts per tt • Storage
C
linear cm (158 signal contacts per linear inch) allow for optimization of
I&I
board space and signal requirements
t • Industrial controls & equipment
00 Ohm differential pair matched impedance assures consistent high
1
speed performance
p to 10 Gb/s differential pair performance
U
ery low cross-talk (VLC) design of less than 1% allows for required
V
signal integrity performance
D
ual beam signal contacts provide two points of contact increasing
product reliability
olarized design assures proper mating of the connector
P