Meg-Array0 pages
BOARD TO BOARD CONNECTORS
MEG-Array® MEZZANINE Connector system
HIGH DENSITY, BGA DESIGN EXCELS AT HIGH SPEED PERFORMANCE AND RELIABILITY
DESCRIPTION
The MEG-Array® Mezzanine Connector
system provides the high density and high
speed benefits of a large array supported by
the reliability and low costs of standard surface
mount PCB assembly.
1.27mm x 1.27mm array of discrete circuit
contacts allows flexible ground distribution to
optimize high speed signal integrity at speeds
exceeding 10 Gb/s. MEG-Array is offered in a
variety of PCB mezzanine stack heights.
FCI’s advanced manufacturing supports a
patented BGA interconnect design. Multiple
in-process vision systems monitor BGA contact
integrity including solder sphere size, location
and co-planarity plus other critical-to-function
attributes.
FEATURES & BENEFITS
TARGET MARKETS /
APPLICATIONS
t High density, high speed, discrete contact, array connector
t Flexible ground distribution optimizes high speed signal integrity
t 10 Gb/s differential pair performance with under 1% cross-talk
t 28 Gb/s high speed performance documented for 4mm and 6mm
ttstack height
Online s-parameter files and signal integrity performance reports tt
tt improve design accuracy and time-to-market
t 1.27mm x 1.27mm grid provides 71 contacts per cm2 density to tt
ttsave space
t COMMUNICATIONS
t Transmission
tt t Access
tt t Switching
tt t Optics
t Networking
t Wide range of sizes and PCB stack heights increase mechanical
t design flexibility
t6 PCB Stack heights: 4mm to 14mm
t8 sizes: 81 to 528 positions
t Revolutionary, trusted BGA interconnect platform
tHigh density standard BGA attachment lowers assembly costs by tt
tt using standard SMT processes
t BGA natural surface tension provides self-alignment and self-leveling t
tt for multiple connector usage
t Patented BGA contact attachment preserves solder ball positioning
t Optimized PCB routing enhances electrical performance
t Quality and Reliability
t Time-tested reliability record includes Telcordia GR-1217-CORE and t
ttNPS-25298-2 options
t 22+ year solder joint reliability per IPC-SM-785
t 17 Billion + lines shipped to customer satisfaction
t Precious metal plating options satisfy varying customer needs for tt
ttenvironmental resistance
t DATA
t Servers
t Storage
tI&I
t Industrial controls & equipment
tt t Analytical & diagnostic
t Medical