ZipLine® High-Density, High-Performance Connectors0 pages

ZIPLINE™ HIGH-DENSITY, HIGH-PERFORMANCE
CONNECTOR SYSTEM
DESCRIPTION
BACKPANEL CONNECTORS
The ZipLine™ connector system addresses customer demand for
maximum signal density – a paramount requirement for future
equipment platforms – at data rates up to 12.5 Gb/s.
The initial ZipLine signal modules with 1.8mm column pitch support
backplane and orthogonal midplane applications. A module with
72 differential pairs – consisting of 12 insert-molded leadframe
assemblies (IMLAs), each supporting 6 high-speed differential
signal pairs - provides the maximum density available by delivering
84.6 differential pairs per inch of card edge. Allowing a minimum
1-inch card slot pitch, the compact module dimensions help
system designers address mechanical and thermal concerns.
The 6-pair ZipLine signal IMLAs can also be configured on 1.5mm
column pitch to provide more than 100 signal pairs per inch of
card edge for even more backplane signal density.
ZipLine connectors use FCI’s proven shield-less technology to
deliver low insertion loss and crosstalk without using costly and
space-consuming metal shields. Data rates can scale up to 12.5
Gb/s without requiring the redesign of a basic platform.
In addition to offering superior signal density and electrical
performance, the versatile ZipLine design allows for mixed
differential (orthogonal or backplane), single-ended or power pin
assignments within a connector. Another unique feature is a special
power wafer, with up to 36A capacity, which can be integrated
within a module.
Complementary guide modules and high-power connector modules
are also available. All ZipLine connectors and accessory modules
are compatible with Hard Metric (HM) equipment design practice.
FEATURES & BENEFITS
Supports backplane and orthogonal midplane applications
6-pair modules with IMLAs on 1.8mm column pitch deliver
84.6 differential pairs per inch of card edge while allowing
a minimum 1-inch card slot pitch
6-pair modules can also be configured on 1.5mm column
pitch to provide >100 pairs per inch for even more density
3-pair configuration is under development to enable use
on 15mm card slot pitch
Provides maximum signal density available at data rates
up to 12.5 Gb/s
Use FCI’s shield-less technology to deliver low insertion
loss and crosstalk
Allows for mixed differential (orthogonal or backplane),
single-ended or power pin assignments within a connector
A special power wafer, with up to 36A capacity, can be
integrated within a 6-pair module
Compatible with Hard Metric equipment practice
TARGET MARKETS / APPLICATIONS
Communications
• Routers
• Switches
• Networking
• Access
• Transport
Data
• Servers
• Storage Systems
Industrial
• Medical
• Test & Measurement