GE
Intelligent Platforms
bCOM2-L1100
Rugged COM Express Board
Features
•t Compliance to PICMG™ COM Express R1.0 basic
form factor, Type 2
•t Processors
- Intel® Core™ 2 processor, soldered
- Up to 2.26 GHz, 1066 MHz FSB, 6 MB L2, 25 W
•t Up to 2 (4) GB DDR3 SDRAM; soldered, non-ECC
•t Intel GS45/ICH9M SFF chipset
- 800/1067 MHz FSB
•t I/O Features
- 1x VGA
- 2x SDVO channels (shared with PEG)
- 1x LVDS (dual channel support)
- 1x Gigabit Ethernet
- 8x USB 2.0
- Audio HDA
- 4x Serial ATA ports (RAID)
- 1x PATA
- 8x GPIO (4 in, 4 out)
•t Expansion
- 1x PCIe Graphics (PEG) x16
- 4x PCIe lanes
•t 4x lanes x1 or 1x lanes x4
- PCI (32-bit / 33 MHz)
•t Extended operating temperature range from
–40° to +85° C
•t Temperature sensors for CPU, chipset
and module
•t Optional conformal coating
•t Support of S0, S3 and S5 states
•t Support for Windows® XP, Vista®, Linux®, and
VxWorks®
•t High shock and vibration immunity
•t Pre-mounted heat sink/spreader for
optimal cooling
The bCOM2-L1100 is a rugged, Type 2 COM
Express module in basic form factor. It
features a soldered Intel Core 2 Duo
processor with varying levels of performance-per-watt improvements to provide
an excellent choice for System Integrators
with low-power, high performance embedded applications requirements.
The bCOM2-L1100 offers up to 4 GB of
soldered DDR3 SDRAM memory to satisfy
an application’s needs. One Gigabit Ethernet port is routed to the COM Express
connector, located on the baseboard. This
port supports transmissions of 10 and 100
Mbit/s. An additional eight USB 2.0 ports
are routed to the COM Express connector.
The bCOM2-L1100 has four serial ATA
Interfaces with RAID 0 and 1 support.
Choose from the parallel-attached hard
disk drive or the new serial ATA drive. The
SATA interfaces are ready for SATA II drives.
For superior graphic performance, the
bCOM2-L1100 features integrated analog
CRT and LVDS interfaces along with two
SDVO channels.
I/O functionality is provided through either
four PCI Express x1 lanes or one x4 lane, a
wide PCI Express x16 port, and one 32-bit/
33 MHz PCI bus.
The x16 port can be used in applications
where high-end graphic and video capabilities are required. Together with the audio
port a wide range of multimedia implementations can be achieved.
All of these functions position the
bCOM2-L1100 in applications for
industrial, simulation/training, test and
measurement, gaming, transportation
and other market segments. With its
soldered components and optional high
shock and vibration protection, the module can be placed in harsh environments.
Furthermore extended temperature and
conformal coating options positions the
module for applications in transportation,
mining, MIL/Aero, and others.
Evaluation, Benchmarks, Development
The carrier board CCAR-L1000 is available
for an easy and quick start, to do benchmarks or even to develop/test application
software. The CCAR-L1000 is designed for
the COM Express module series. The carrier supports the standard features of the
bCOM2-L1100 plus PCI and PCI Express
slots. For detailed functions see the
CCAR-L1000 datasheet.