SE 70 - Low Temperature Cure High Toughness Epoxy Prepreg System (v6)0 pages

SE 70
Low Temperature Cure High Toughness
Epoxy Prepreg System
n Low temperature 70°C curing
n Faster cycle times at elevated temperature
n Excellent balance of mechanical properties and toughness
n Long outlife - up to 4 weeks @ 18-22°C
n Range of compatible adhesive films and ancillary products
n Excellent surface finish
n Good Tg
n Suitable for vacuum bag, press or autoclave consolidation
Introduction
SE70 is part of the range of SPRINT® products. This unique product range provides technically and commercially
competitive engineering materials, ideal for use either solely, or in conjunction with other products from within the
product range along with other Gurit products.
SE70 is a hot melt, Diuron free epoxy SPRINT® ideally suited to the manufacture of thick sections. It can be cured at
temperatures as low as 70°C, but can also be used for the rapid manufacture of components through its 25-minute
cure at 120°C. All of this can be achieved together with an out-life of 21 days at 21°C.
SE70 is designed for vacuum bag processing and offers excellent mechanical performance on glass fibre
reinforcements. Currently SE70 is manufactured into a SPRINT® structure with E-glass and Carbon fibres, which are
manufactured into biax or woven materials. This data sheet is concerned with carbon reinforcements.
PDS-SE 70-6-0313
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