HexPly® M26/M26T 120 °C (250 °F) curing epoxy matrix0 pages

HexPly® M26/M26T
120 °C (250 °F) curing epoxy matrix

Product Data

Description
HexPly® M26 is an advance modified epoxy resin developed for aerospace and industrial markets.Its
controlled flow, high peel strength on honeycomb cores and excellent fire behaviour give it a cost saving
potential for interior and secondary sandwich structures. Combined with HexPly® M25 glass phenolic
prepregs, it is qualified to Airbus specifications.

Benefits and Features
I 120 °C (250 °F) cure
I Self-extinguishing to ABD0031 requirements
I Self-adhesive on honeycomb and foam
I Environmentally friendly
I Controlled flow matrix
I Low pressure moulding capability 0.8-3 bar (12-43 Psi)
I Cure cycle versatility 100-150 °C (212-302 °F)
I Good impact resistance
I Compatible with HexPly® M25 phenolic resin system
I Two grades available:

- M26, reduced tack grade, for flat panels applications,
- M26T, improved tack grade, for other sandwich structures.