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Huaray DPSS Laser Applications/Cases/UV/Green0 pages
应用领域
精密加工应用实例
Application Fields
Micro Machining Application
平板背壳打标 —— 对比度高热影响小无变形加工效率高。
ITO薄膜刻蚀 ITO film etching
Laser marking on the back panel of Tablet PC -- A high contrast, slight thermal damage, without deformation, high efficiency.
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切缝窄至10μm左右热影响小。
A narrow cutting crack about 10μm, small thermal effect.
L1
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加工过程后中无需后续处理。
Without subsequent treatment after processing.
0.0117
0.1mm(放大330倍)
FPC、覆盖膜激光加工 FPC and film laser processing
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切缝边缘垂直度好, 切边光滑。
Perfect edge perpendicularity of joint-cutting, smooth incisions.
非接触式加工边缘无机械加工产生的溢胶和毛刺。
Non – contact processing, without adhesive migration and burrs caused by
mechanical operations.
激光打标 Laser marking
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辨识度高加工效果精细。
High visual resolution, fine processing effect.
一次性加工永久性标记。
Permanent mark just by one-off processing.
陶瓷划线 Ceramic scribing
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加工精度高使用寿命长。
High machining precision, long machining life.
界限明晰边缘整齐。
With sharply defined, regular edges.
深度打标 —— 轮廓清晰边缘整齐深度0.5mm以上边缘无碳化。
Depth marking -- A clearly defined outline, regular edges, over 0.5mm depth, without carbonization.
晶圆切割 Silicon wafer cutting
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切缝小材料利用率高。
Small cutting crack, perfect material utilization.
切割过程产生碎屑少微裂纹小。
Little dust produced during cutting, tiny micro-cracks.
激光钻通孔 Laser drilling
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紫外钻孔精度高热影响区小。
High drilling precision, small heat influence area.
加工效率高。
High efficiency.
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