X-Mill0 pages

Product Summary
The X-MillTM is a mechanical milling instrument, featuring state-of-theDUW WHFKQRORJ\ WR SUHFLVHO\ DQG HI¿FLHQWO\ SUHSDUH VDPSOHV IRU HOHFWULFDO
and physical failure analysis applications. This easy-to-use and highly
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analysis of complex integrated circuits and packages.

Backside Thinning

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Backside Device Thinning:
FIB/Laser/Photon/SIMS
Stacked Die Package Deprocessing
Multi-Chip Module Preparation
Pre-Chemical Decapsulation
Package Substrate Delayering
Frontside Circuit Delayering

Stacked Die Deprocessing

Multi-Chip Module Preparation

Advancing Technology In Sample Preparation
Advancing Technology In Sample Preparation