Wire bond resistors0 pages

AT C W I R E B O N D A B L E R E S I S T I V E P R O D U C T S

ATC WBR1 Series
Wire Bond Resistors
(Top Contact/Bottom Isolated)
Features:
• Resistance Range: 2.5 KΩ to 250KΩ*
• Outline Size: 20 x 20 mils (0.51 x 0.51 mm)
• Passivated SiCr Resistor Material
• Gold Wire Bondable
• Ultra-High Stability
• Extremely Low TCR available (±25 ppm/°C)
• Laser Trim for Tight Tolerances
• Top Contact / Bottom Isolated

Applications:
• Hybrid Chip on Board
Circuits

• Unique A-Face Value Marking
*Custom resistance values to 10 MΩ and aluminum
bond pads are available. Please contact Factory.

• Ideal for Hybrid Circuit Applications

American Technical Ceramics offers the WBR1 Series
precision Wire Bondable Resistors. These resistors are
designed specifically for applications that require stable
thermo-compression, ultrasonic or epoxy die attachment. This device is built in an 0202 chip outline and is
ideal for but not limited to hybrid circuit applications.
The WBR1 utilizes our proprietary SiCr thin film resistor. This results in extremely tight tolerances and superior Temperature Coefficient of Resistance (TCR).
Tolerance of ±0.1%, with absolute TCR of ±25 ppm/°C
is available. The WBR1 offers excellent stability and
reliability and is suitable for the most demanding
applications.

• Bias Networks
• Test and Measurement
Equipment
• Aerospace
• Medical
• Automotive
EIA resistance values with 1% tolerance are available
for sampling. Please contact Factory.

RESISTANCE VALUES (KΩ)
2.7
3.3
4.7
5.6

6.8
8.2
10
12

WBR1 Series Power Derating

80
60
40
20
0
-65 -45 -25

-5

15

35 55

75

95 115 135 155 175

Temperature (°C)

33
39
47
56

68
82
100
120

150
180

ATC WBR1 Life Test Data

0.000

100

15
18
22
27

NOTE: Values listed are for TCR <100 ppm/°C

% Res Change

% Power Applied

120

• Multi Chip Module (MCM)

-0.010
-0.020
-0.030
-0.040
-0.050
0

200

400

600

800

1000

1200

Time (hrs)

250 mW (70°C, derated to 0 at 150°C) on alumina

ATC # 001-1109
Rev A, 5/12