MacroChip Series0 pages

Thick Film
Surface
Mount

High Voltage/High Resistance
Precision Thick Film Surface Mount
Ohmite’s MacroChip resistors bring
precision high voltage capabilities to
surface mount applications. Designed
with thick film on alumina substrate
technology, the resistors can be provided in precision tolerances, high voltage ratings, and high resistance values.
The planar package design is low profile
for easy use with instrumentation, medical equipment, voltage regulators, and
power supplies.

F e at u r e s

• Non-inductive design (less
than 50 nanohenries)
• Low voltage coefficient
• Surface mount
• Pd Ag terminations
• J-bend terminals for applications involving shock and
vibration

A p p l i c at i o n s

• Medical instrumentation
• Power Supplies
• Avionics
• Light Magnification Systems

S ER I E S S PEC I F I CAT I ON S

Series
MC101
MC102
MC103
MC104
MC202
MC204

Resistance
Range (Ohms)
100Ω to 1,000M
200Ω to 5,000M
250Ω to 5,000M
1K to 5,000M
500Ω to 5,000M
1K to 5,000M

Power
@25°C
0.75W
1.50W
2.00W
2.50W
2.50W
3.25W

Voltage
Rating
2.0KV
5.0KV
7.5KV
10.0KV
5.0KV
10.0KV

Standard Temp. Coefficient 85°-125°C
50PPM/°C
100PPM/°C
100Ω-100M
101M-1,000M
200Ω-250M
251M-5,000M
250Ω-100M
101M-5,000M
500Ω-450M
451M-5,000M
500Ω-200M
201M-5,000M
1K-375M
376M-5,000M

Contact Ohmite for custom configurations.

c h a r a c t e r is t i c s
Resistor Thick film on Alumina
Resistance Range 100 Ohms to 5,000M
Power Rating 0.75W to 3.25W
Voltage Rating 2.0KV to 10.0KV
Tolerance 0.5% to 20%
Operating -55°C to +180°C
Temperature
TCR and VCR See chart below
Solder Silver solder is recommended for
Macrochip resistors. Leaching of
the silver in the termination will
occur if non-silver solder is used.
60/40 tin-lead solders are not
recommended for use with the
Macrochip product.

300

Preheating: 145°C ±15°,
max. 120 sec.

Soldering
10 sec.

250
200

Preheating

60 sec.

120 sec.

150

Cooling

p e r f o r m a n c e d ata
Characteristic Test Method
Humidity MIL-STD-202, Method 103B,
Condition B
Dielectric Withstanding MIL-STD-202, Method 301,
Voltage 750V
Insulation Resistance MIL-STD-202, Method 302,
Condition A or B
Thermal Shock MIL-STD-202, Method 107G,
Condition B, B-1, or F
Load Life MIL-STD-202, Method 108A,
Condition D
Resistance to Solvents MIL-STD-202, Method 215G

0

50

100 150 200
Time (sec.)

±0.25%
>10,000M or
greater dry
±0.20%
±1.0%
No degradation of coating
or marking
±0.25%
±.020%

Power Conditioning MIL-R-49462A, Par 4.8

Soldering: min. 220°C,
max. 60 sec.

50
0

±0.25%

Shock (Specified Pulse) MIL-STD-202, Method 213B,
Condition I

Max. Temp.: 260°C ±5°,
10 sec.

100

Specification

Vibration, High MIL-STD-202, Method 204D,
Frequency Condition D

Recommended Solder Profile

Temperature °C

High
Voltage

Macrochip Series

250

1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com • info@ohmite.com

±0.50%