PY-CHP-SINGLE Die Datasheet0 pages

PY-CHP-SINGLE

SINGLE CHANNEL
PYROELECTRIC SENSOR DIE
Introduction

The Pyreos thin film pyroelectric
sensor
technology
offers
the
opportunity to build
component
products with a controlled response
time and offering exceptionally high
and stable responsivity. over a wide
operating frequency range. The MEMs
based thin film structure of the
pyroelectric sensor can be harnessed
to provide low microphonics along with
class leading thermal and electrical
stability. The sensor die are rugged
and are compatible with automated
assembly including surface mount
processes.

Physical Dimensions
Die Size
Die Thickness
Element size
Membrane Size
Bond pad size

1.96 x 1.96mm +/- 10%
400 µm +/-20 µm
1000 x 1000 µm
1600 x 1500 µm +/-10%
100 x 200 µm

Die supplied in waffle trays or blue tape

PZT Thickness
Dielectric Const.
Dielectric Loss
{10kHz, 1V, 25oC}

1.40 µm +/- 0.2 µm
270 +/- 30
< 1%
measured on wafer test
structures

Packaging Information
The sensor die have good thermal and
mechanical stability and are compatible
with standard semi-conductor back-end processes including, epoxy die attach process, gold
thermo sonic ball bonding, ultrasonic wedge wire bonding and automated pick & place
equipment. For the purposes of die attach Pyreos recommends that the thermally conductive
epoxy is used, and that only three sides of the die are attached with epoxy
Please note: the information contained in this document is subject to change without further
notification. Pyreos reserves the right to alter the performance and any resulting specification. Pyreos
may choose not to supply any engineering sample devices as a commercial product. No
responsibility is accepted for any consequential loss incurred. Pyreos Ltd, SMC, West Mains Road,
Edinburgh EH9 3JF, UK. Tel:+441316507009, www.pyreos.com; © Copyright Pyreos Ltd 2010