WPM0 pages

PRODUCT SHEET HEAT SINK
FOR THE COOLING OF SEMICONDUCTORS

WPM-XXX_EN_V1.2

WPM Water Plate Module

Water cooled heatsink for high power applications
Our WPM water cooled heatsink enables to evacuate the calories produced by high power semiconductor
modules.
The cold plate is optimized on its main face for the cooling of ECONOPACK+ and ECONODUAL modules, high
power HVIGBT modules and MEGA POWER DUAL or PRIMEPACK modules.
The opposite face allows to use all the other modules with different sizes (diode modules, ISOTOP housing,
80mm pitch modules).

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ARCEL - ZI du Tronchon - 2, rue des Aulnes - 69544 CHAMPAGNE AU MONT D’OR Cedex - France
Tél. 33 (0)4 78 35 02 21 - Fax 33 (0)4 78 35 69 54 – www.arcel.fr

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