Document Title Document ID/Size Revision Score 1.35 Watt Audio Power Amplifier with Selectable Fast Turn On Time0 pages

© Semiconductor Components Industries, LLC, 2009
November, 2009 - Rev. 2
1 Publication Order Number:
NCP2991/D
NCP2991
1.35 Watt Audio Power
Amplifier with Selectable
Fast Turn On Time
The NCP2991 is an audio power amplifier designed for portable
communication device applications such as mobile phone
applications. The NCP2991 is capable of delivering 1.35 W of
continuous average power to an 8.0 BTL load from a 5.0 V power
supply, and 1.1 W to a 4.0 BTL load from a 3.6 V power supply.
The NCP2991 provides high quality audio while requiring few
external components and minimal power consumption. It features a
low-power consumption shutdown mode, which is achieved by
driving the SHUTDOWN pin with logic low.
The NCP2991 contains circuitry to prevent from “pop and click”
noise that would otherwise occur during turn-on and turn-off
transitions. It is a zero pop noise device when a single ended or a
differential audio input is used.
For maximum flexibility, the NCP2991 provides an externally
controlled gain (with resistors). In addition, it integrates 2 different
Turn On times (15 ms or 30 ms) adjustable with the TON pin.
Due to its superior PSRR, it can be directly connected to the
battery, saving the use of an LDO.
This device is available in a 9-Pin Flip-Chip CSP (Lead-Free).
Features
• 1.35 W to an 8.0 BTL Load from a 5.0 V Power Supply
• Best-in-Class PSRR: up to -100 dB, Direct Connection to the
Battery
• Zero Pop Noise Signature with a Single Ended Audio Input
• Ultra Low Current Shutdown Mode: 10 nA
• 2.5 V-5.5 V Operation
• External Gain Configuration Capability
• External Turn-on Time Configuration Capability: 15 ms or 30 ms
• Thermal Overload Protection Circuitry
• This is a Pb-Free Device*
Typical Applications
• Portable Electronic Devices
• PDAs
• Wireless Phones
*For additional information on our Pb-Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques Reference
Manual, SOLDERRM/D.
9-Pin Flip-Chip CSP
FC SUFFIX
CASE 499E
PIN CONNECTIONS
MRH = Specific Device Code
A = Assembly Location
Y = Year
WW = Work Week
= Pb-Free Package
MARKING
DIAGRAMS
A3
B3
C3
A2
B2
C2
A1
B1
C1
INM OUTA INP
VM TON VP
BYPASS OUTB SHUTDOWN
(Top View)
See detailed ordering and shipping information in the package
dimensions section on page 14 of this data sheet.
ORDERING INFORMATION
MRH
AYWW
http://onsemi.com
A1