QuadMo747-X/i.MX60 pages

Qseven
QuadMo747-X/i.MX6
Computer on Module with Freescale™ i.MX6
Processor
CPU
Single-, Dual- and Quad- Core (ARM
Cortex™A9 Cores)

ARM

Graphics
2D/3D dedicated graphics processors

Memory
up to 4GB DDR3L onboard

Temperature
Also available in Industrial temperature
range, -40°C ÷ +85°C

HIGHLIGHTS

Processor

Freescale™ i.MX6 Family, based on ARM Cortex-A9 processors:
Single core (i.MX6S) up to 1GHz
Dual Core (i.MX6D), Dual Core Lite (i.MX6DL) up to 1.2GHz
Quad Core (i.MX6Q) up to 1GHz clock

Max Cores

4

Memory

up to 4GB DDR3L onboard (up to 2GB with i.MX6S)

Graphics

Video Interfaces

integrated graphics, each processor provides up to 3 separated
accelerators for 2D, OpenGL® ES2.0 3D and OpenVG™
(OpenVG™ accelerator only available with i.MX6D and with i.MX6Q)
Supports up to 3 independent displays (only up to 2 displays with
i.MX6DL and i.MX6S)
HDMI interface
1 x Dual Channel or 2 x Single Channel 18/24 bit LVDS interface

1 x SATA interface (only with i.MX6D and i.MX6Q)
eMMC soldered onboard
MMC/SD/SDIO interface
1 x μSD card slot onboard

Networking

1x USB OTG
4x USB 2.0 Host

PCI-e

Flexible solution enables multi-display
platforms to mobile fanless applications

1 x PCI-Express x1 lane

Audio

•t

OpenGL (FULL) and OpenES 2.0 3D
Graphics and up to 3 independent displays
(only up to 2 displays with i.MX6DL and
i.MX6S)

Gigabit Ethernet interface

USB

•t

Combines and emphasizes high-graphics
performance with power-efficient processing
capabilities

HDMI, up to 1080p
LVDS, up to 1920x1200

Mass Storage

•t

A scalable multi-core ARM® Cortex™-A9
architecture in Qseven® standard modular
solution

AC97 Audio Interface

Serial Ports

Other Interfaces

2 x serial ports
CAN Bus interface
Video Input Port / Camera Connector
LPC BUS or 8 x GPI/O
SMBus
SPI
I2C bus

Power
Consumption

Linux
Android
Microsoft® Windows® Embedded Compact 7

Operating
Temperature*

Industrial Automation Digital Signage
- Infotainment
and Control

Automotive

0°C ÷ +70°C (commercial version)
-40°C ÷ +85°C (industrial version)

Dimensions

MAIN FIELDS OF APPLICATION

Embedded additional RTC circuitry for lowest power consumption

Operating
System

i.MX6Dual/ 6Quad

050.15

Video
Resolution

•t

70 x 70 mm (2,76” x 2,76”)

*Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual
temperature will widely depend on application, enclosure and/or environment. Upon customer to consider
specific cooling solutions for the final system.

Information subject to change. Please visit www.seco.com to find the latest version of this datasheet

FEATURES

Avionics

Energy

Robotics

Surveillance

Transportation

Please visit www.seco.com for thermal dissipation information

www.seco.com