CX700M (Single-Chip)0 pages

VIA

CX700M
CX700M2

*

Unified Digital Media IGP
* CX700M2 has Macrovision® support

The VIA CX700M integrates premium graphics, audio, memory, storage, and HDTV support all in a single-chip
design. This unified design enables the creation of smaller form factor designs, reduced power consumption,
and easier cooling, all of which opens the door for an expanded range of embedded solutions. This is all done
in a single-chip package exactly the same size as a North Bridge (37.5 mm x 37.5 mm) — representing a saving
of over 34% in board real estate. This represents a major breakthrough for the embedded industry where ultra
compactness is essential, and will have significant benefit for embedded boards such as PC/104 and VIA EPIA®
mainboards.
Complementing VIA's Nano™, C7® or Eden™ processor it supports, the VIA CX700M is based on a highly
sophisticated power efficient architecture that enables such rich integration into a compact package with
a maximum power envelope of just 3.5 watts. A number of key power management technologies are
incorporated that monitor activity and dynamically control power according to system load requirements.
Targeted for key embedded applications such as Point of Sales (POS) equipment, industrial PCs (IPC) and ultra
compact, low power desktop systems such as thin clients, the VIA CX700M has been designed from the ground
up to deliver excellent performance, features and power efficiency. The reduction in board space and operating
power requirements together with the extensive multimedia, memory, connectivity and display flexibility
provides embedded customers with the ideal chipset to take their ultra compact systems to the next stage.

Key Features
Host Interface
VIA Nano™ / C7® / Eden™ processor (up to 800
MHz FSB)
Memory Controller
Two DDR / DDR2 DIMMs
Supports 32 / 64-bit memory data width
Supports ECC
High Definition Audio Interface
Up to 32-bit sample size at 192 kHz sampling
rate
Supports eight High Definition audio channels
Supports High Definition modem
Integrated 2D / 3D / Video Processor
128-bit 2D / 3D graphics engine
32 / 64 / 128 MB frame buffer sizes
High Definition video processor and overlay
engine
Unified Video Decoding Processor
MPEG-2 MP@HL video decoding acceleration
WMV9 MP@ML video decoding acceleration
Significantly reduces host processor utilization
and system power consumption
Video Capture Port
Dual Transport Stream inputs or dual 8-bit
tor one 16-bit CCIR656/601 input

Display Interface
Three 10-bit 350 MHz RAMDACs for CRT and TV
SDTV output mode (525p or 625p)
HDTV support for 1080i and 720p
Macrovision® support (CX700M2 only)
LVDS / DVI interface in three configurations:
LVDS: One Dual-channel or two Single-channels
DVI: One Single-channel
DVI + LVDS: One Single-channel DVI and one
tt Single-channel LVDS
DuoView+™ enables multi-monitor and extended

desktop support using two independent display
engines
Storage Interface
Supports up to two SATA (3 Gbps) devices
Supports up to two EIDE devices
Expansion Interface
PCI bus with up to four master devices
LPC bus for Super I/O extension
One DVP interface for external TV encoder or DVI
transmitter
Peripheral Expansion Bus
Six USB 2.0 / 1.1 ports
Two RS-232 serial ports (optional)
Power Management
Dynamic clock gating control
ACPI 2.0 and APM v1.2 compliant
TDP Power
TDP max: 3.5 W