VX900/H0 pages

VIA

VX855

Unified Digital Media IGP

The VIA VX855 is a low-power, highly integrated all-in-one system processor chip in a small 27 mm x 27 mm
package that addresses key requirements of small form factor, high performance, power sensitive embedded
applications. The VIA VX855 is VIA’s first integrated single chip that introduces the advantages of nextgeneration high definition H.264 and VC-1 video compression algorithms while maintaining a maximum power
of only 2.3 watts, delivering the best performance in a small package.
The VIA VX855 integrates a high performance DDR2 memory controller (up to 800 MHz), a 400/800 MHz FSB
CPU interface, and extensive I/O capabilities (such as EIDE, USB 2.0, SDIO, UART, SPI, LPC and SMBus) in a single
chip. It supports the VIA Chrome9™ HCM DX9 3D engine, High Definition audio controller, and plenty of display
interfaces in its LVDS transmitter, CMOS LCD interface and CRT interface for more flexible multimedia playback
options. It also supports dual independent displays on the same platform.
VIA VX855 provides an advanced 3D graphics experience, which is powered by its high frequency GFX graphic
engine and unified video decode acceleration. The high performance image processing features includes
support for full hardware acceleration of leading video standards including H.264, MPEG-2, VC1, and WMV9 —
greatly relieving the burden and reducing the power consumption of the CPU at the same time. The VX855
also supports up to three audio streams (up to eight channels each) with 32-bit sample depth and sample rates
up to 192 kHz.
The VX855 has a thermal design power (TDP) of 2.3 watts and is validated with Nano™, C7® and Eden™
processors. Together with Nano™ processor, the whole platform has a combined TDP of 15.3 watts, delivering
incredibly high performance for demanding multimedia entertainment and making it ideal for many
embedded market segments such as digital signage, in-vehicle entertainment, infotainment machines,
interactive clients (POS, kiosks), gaming, and industrial control.

Key Features
Host Interface
VIA Nano™/C7®/Eden™ processor (up to 800 MHz
FSB)
Memory Controller
Supports up to two 64-bit DDR2 800 DIMMs (4
GB max)
High Definition Audio Interface
Up to 32-bit sample depth at 192 kHz sampling
rate
Supports three codecs and eight streams
Supports High Definition modem
Integrated 2D / 3D / Video Processor
VIA Chrome9™ HCM DX9 3D engine
128-bit 2D engine with hardware rotation
capability
High Definition video processor with VMR
capability
Up to 512 MB frame buffer
Unified Video Decoding Processor
MPEG-2, H.264 decoder
VC1 video decoding acceleration
Video Capture Port
Supports CCIR656/CCIR601 input
Supports parallel and serial transport stream
input

Display Interface
Three 10-bit 350 MHz RAMDACs
Single–channel LVDS
18-bit TTL
Supports DuoView+™
Storage Interface
Supports UDMA IDE
Supports SD/MS/MMC/XD
Peripheral Expansion Bus
Supports six USB 2.0 ports
One USB client 2.0 device port
Supports LPC bus
Supports SDIO, SPI and UART
Power Management
ACPI 3.0 and PCI Bus Power Management 1.1
compliant
Snapshot extensive system power management
Package
Flip-Chip Ball Grid Array (FCBGA)
Size: 27 mm x 27 mm
TDP Power
TDP max: 2.3 W