HZ60000 pages
2
TM
Technology
TM
ZYGO CORPORATION’S
HZ6000™
Fully automatic High Speed
Metrology for Singulated
Flip-chip substrate
FMI2 2D/3D high accuracy vision sensor
Large area sensor for market-leading
throughput
Best available accuracy
High Speed / High Accuracy modes
Industry leading accuracy and
repeatability
C4 bump inspection
Extensive 2D/3D metrology for
flattened and round bumps
Pinned substrate configuration available
Support industry-standardor
custom trays
Standalone or inline configurations
available
ZYGO CORPORATION INTRODUCE THE
THIRD GENERATION OF FULLY-AUTOMATIC
VISION SYSTEM DEDICATED TO 100%
INSPECTION OF FLIP-CHIP SINGULATED
SUBSTRATES.
NOW WITH THE MOST ACCURATE
3D SENSOR AVAILABLE FOR C4 BUMP
INSPECTION, ZYGO’S HZ6000™ IS A HIGHTHROUGHPUT HIGH-ACCURACY TOOL
FOR DEDICATED INSPECTION OF
C4 ROUND AND FLATTENED BUMPS.
With today’s ongoing trends in decreasing feature sizes and
higher I/O requirements, the flip-chip substrate industry faces
an important challenge of achieving greater quality through
improved process control in substrate manufacturing production.
Ready to meet that challenge, the new ZYGO’s HZ6000™ tool
series for 100% inspections is an innovation in true 3D
measurement for substrate manufacturers. The HZ6000™ series,
designed for inspection of singulated substrates, offers
unparalleled throughput and accuracy for measurement of
volume, height, diameter, Coplanarity and Warpage in
high volume production. Results is total quality control for
flip-chip substrate manufacturers.