CSP-30000 pages
Z Y G O C O R P O R AT I O N ’ S
High speed,
high accuracy fully
automatic HVM
inspection solution
for FC-CSP strip
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Full inspection of FC-CSP strips
of round and flat bumps
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Integrating ZYGO’s new FMI-3™
technology for best available
accuracy
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Industry leading throughput
(>200 SPH)
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Measures both mixed (round
and flat) bumps in a single pass,
at high accuracy
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Support thin strips, POP, MultiCore Modules, mixed bump types
Zygo Corporation introduces the third generation of fully-automatic
Stacker and magazine type
configurations
substrates. now with the most accurate 3D sensor available for C4 bump
Lowest cost of ownership with
highest reliability
for dedicated inspection of C4 bumps on CSP strips.
SECS/GEM and SEMI S2-S8
compliance available on request
smaller die sizes, and minimized packaging costs continues to shape the
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vision system dedicated to 100% inspection of flip-chip CSP (FC-CSP)
inspection, ZYGO's CSP-3000™ vision system is a high-throughput tool
As the demand for increasingly high-performance semiconductors,
flip-chip industry as well as the development of new package types, two
constants remain for FC-CSP inspection: high volume and flexibility.
Backed by industry-proven inspection capabilities and extensive
experience in C4 bump inspection, ZYGO's CSP-3000 vision system is
now more powerful than ever with the market-leading precision of the
new FMI-3 technology. The CSP-3000 vision system with the FMI-3
technology is a flexible and cost-effective solution to meet current and
future requirements of the substrate industry.