PYROELECTRIC SENSOR DIE0 pages

PYFCHP 1x1
Please note: the information contained in this document is draft only and subject to change without
further notification. Pyreos reserves the right to alter the performance and any resulting specification.
Pyreos may choose not to supply any engineering sample devices as a commercial product. No
responsibility is accepted for any consequential loss incurred. Pyreos Ltd, SMC, West Mains Road,
Edinburgh EH9 3JF, UK. Tel:+441316507009, www.pyreos.com; © Copyright Pyreos Ltd 2009
PYROELECTRIC SENSOR DIE
Introduction
Pyreos is pleased to present our unique
thin film pyroelectric dual element detector
as bare die. This die is optimized for
maximum performance in the 3-5 micron
range. Please contact Pyreos if you
require optimized performance outside this
spectral range.
Device Parameters:
Die size / type nom. 1.96 x 1.96 mm ± 0.2
Element size nom. 1000 x 1000 ìm
Element capacitance
{10kHz, 1V, 25oC}
typ. 2.3 nF ± 10%
Element dielectric loss
{10kHz, 1V, 25oC}
max. < 1%
Operating / storage temperature nom. -25 ... +85oC
Packaging Information:
The sensor die have good thermal and mechanical stability and are compatible with standard
semi-conductor back-end processes:
• Epoxy die attach process
• Gold thermo sonic ball bonding
• Ultrasonic wedge wire bonding
• Automated pick & place equipment
For the purposes of die attach Pyreos recommends that
• Thermally conductive epoxy is used
• Only three sides of the die are attached with epoxy. An air gap should be present under
the fourth side to ensure that no pressure differential builds up across the membrane.
• No mechanical contact should be made with the membrane surface. The membrane
must remain stress and damage free during die attach and wire bonding processes.