LUXEON FlipChip UV0 pages

General Illumination

LUXEON FlipChip UV
Chip-scale package for maximum
design flexibility in UV applications
LUXEON FlipChip UV is the smallest and highest power density (W/cm2)
ultraviolet with FlipChip Technology in a chip-scale package LED can
be reflowed onto a substrate with a standard surface mount (SMT)
equipment and process. LUXEON FlipChip UV LED enables tighter beam
control and high packing density of LEDs on a chip-on-board solution
and completely eliminates wire bonds in the system. LUXEON FlipChip UV
is the ideal choice for cost sensitive applications to achieve high
irradiance at high current density, maximizing W/$ by taking the
advantage of lowest thermal resistance of a chip-scale package device.

Features and BENEFITS

Primary Applications

Ultraviolet wavelength range of 380–410nm for a range of options

Specialty Lighting

Micro sized CSP: 1.0mm2 package for design flexibility and packing density
No wire bonds allows for direct attach and reflow
5-sided emitter with batwing radiation pattern enables wide viewing angles
Low thermal resistance for leading system level lm/$
Maximum drive current of 1A for delivers superior lumens for reduced
LED count

RoHS

COMPLIANT

DS137 LUXEON FlipChip UV Product Datasheet ©2015 Lumileds Holding B.V. All rights reserved.