LUXEON FlipChip0 pages

LUXEON FlipChip
High Current Density FlipChip

Introduction
Philips Lumileds LUXEON FlipChip LED Technology enables the next generation of lighting applications. Customers
now have complete design flexibility to access Lumileds’ industry leading performance at the die level and customize
the phosphor and packaging to best suit their lighting applications.
LUXEON FlipChip is a real chip scale package LED that can be attached by reflow without additional packaging.
Traditional wire bonding limits the packing and power density of LEDs. LUXEON FlipChip LEDs can be packaged
closer and can be driven at a higher current density, therefore requiring fewer emitters to achieve a higher lumen
output at higher lumen densities.
This document contains the performance data needed to design and engineer Philips Lumileds LUXEON FlipChip
based application.

Features

Benefits

Key Applications

•t High drive current up to 1A/mm2

•t High current density for high

•t High-power LED emitters

•t 1.0mm x 1.0mm 5-sided emitter

lumen and lm/$ at high lm/W

•t 445-460nm wavelength range

•t High-packaging density

•t Low typical forward voltage of 2.9V

•t 5-sided emitter for dispense and

•t Low thermal resistance
•t Symmetric, larger bond pads with
under bump metallization finishing

remote phosphor applications
•t Surface mount capable
•t No wire bonds
•t Robust design with proven
Lumileds reliability

LUXEON FlipChip DS116 ©2014 Philips Lumileds Lighting Company. t

•t Chip-on-board
applications
•t Remote phosphor
applications