ASIC, Foundry & COT Solutions0 pages

Sales Sheet
ASIC, Foundry & COT Solutions
Highlights
• Toshiba has more than
25 years of experience
in ASIC design and has
delivered over onehundred
90 nm designs
in volume production
over the last two years.
• Toshiba is Japan’s largest
semiconductor
manufacturer and the
3rd largest worldwide.1
• Toshiba continues
investment in its
Electronic Devices
business with a multibillion
dollar Capex and
R&D investment planned
over the next several
years.
• Toshiba is a leading
patent holder with 1,603
utility patents granted in
the United States in 2008.
(U.S. Patent Office)
Advanced CMOS technology for ASIC,
Foundry and COT businesses includes full
service chain management.
.. CUSTOMER BENEFITS
Leading-edge CMOS technology through
in-house process development
• 65 nm LP in mass production
• 40 nm LP libraries are available
• 32/28 nm under development
• 22 nm in research
• Continuous expansion of System LSI
wafer fabrication at multiple locations
• RFCMOS technology, 0.13ì, 90 nm and
65 nm LP
Customized System-on-Chip (SoC)
development based on wide Intellectual
Property (IP) line up
• In-house analog cell development
(mixed-signal IP)
• In-house and 3rd party digital IP
• Processor skills (ARM® and MIPS®)
• Embedded memory (SRAM, eDRAM,
eFLASH, OTP)
Local competence and support – U.S.
Design Centers
• Highly skilled engineers with many years
of chip design experience
• Support of flexible service interfaces from
Customer Owned Tooling (COT) to full
ASIC
• Development support – EDA/PDK
• Mass production ramp-up
(qualification and yield improvement)
Short development Turn-Around-Time (TAT)
to meet the market window
ASIC, Foundry & COT Solutions
1
• Professional project management during
development
• Optimized manufacturing process
• World-class learning curve in Defect
Density Reduction for Advanced processes
Flexible platform concept for SoC
development
• Re-synthesizable and fully customized
UniversalArray™ for high flexibility and low
risk
Flexible business models for ASIC, Foundry
and COT
• ASIC: one partner for design,
implementation, packaging and full service
supply chain management.
• COT: Reduce risk by choosing from
Toshiba’s own IP library with access to
Toshiba’s reliable infrastructure, mask
making and die package solutions.
• Foundry: Selective foundry services (wafer,
chip-die, assembly, test).
• A multitude of business models can be
realized through Toshiba’s open and
advanced Integrated Device
Manufacturer (IDM) model.
www.Toshiba.com/taec
Technology Offering
65nm LP 40nm LP
Low Voltage VDD 1.2V 1.1V
Core Device HS Yes Yes
LP Yes Yes
LL Yes (ULL) Yes (LL)
Core/IO Device VDD 1.8V 1.8V
HS Yes Yes
High Voltage VDD 1.8V 1.8V
IO Device LP — Yes
VDD 2.5V 2.5V
LP Yes Yes
VDD 3.3V 3.3V
AL Yes —
LP Yes Yes
SRAM UDR Yes Yes
UHD Yes Yes
AL : Analog Device (Thick Oxide, Low Threshold
UDR : Ultra Data Rate
UHD : Ultra High Density
Toshiba Technology Offerings