cExpress-HL0 pages

cExpress-HL

COM Express® Compact Size Type 6 Module with
4th Generation Intel® Core™ i7/i5/i3 Processor
Features

Type 6

t 4th Generation Low Power Intel® Core™ i7/i5/i3
Processor SoC
t Up to 16 GB DDR3L SDRAM at 1600MHz
t Two DDI channels, one LVDS supporting
3 independent displays
t Four PCIe x1 or 1 PCIe x4, Gigabit Ethernet
t Four SATA 6 Gb/s, two USB 3.0, six USB 2.0
t Supports Smart Embedded Management Agent
(SEMA) functions
t Extreme Rugged™ operating temperature:
-40°C to +85°C (optional)

Specifications
Ethernet

Core System
CPUt
t

4th Generation Intel® Core™ Processors (Mobile) - 22nm
(also know as “Haswell-ULT”)
Core™ i7-4650U 1.7 GHz (3.3 GHz Turbo), 15W (2C/GT3)
Core™ i5-4300U 1.9 GHz (2.9 GHz Turbo), 15W (2C/GT2)
Core™ i3-4010U 1.7 GHz (no Turbo) 3MB, 15W (2C/GT2)
Celeron® 2980U 1.6 GHz (no Turbo) 15W (2C/GT1)
Supports : Intel® VT, Intel® TXT, Intel® SSE4.2, Intel® HT
Technology, Intel® 64 Architecture, Execute Disable Bit, Intel®
Turbo Boost Technology 2.0, Intel® AVX2, Intel® AES-NI,
PCLMULQDQ Instruction, Intel® Secure Key and Intel® TSX
Note: Availability of the features may vary between processor SKUs.

Memoryt

Intel® MAC/PHYt
Interfacet

i218LM (Enterprise SKU) with AMT 9.0 support
10/100/1000 GbE connection

I/O Interfaces
USBt
SATAt
Serialt
GPIOt

2x USB 3.0 (USB 0,1) and 6x USB 2.0
(USB2,3,4,5,6,7)
Four ports SATA 6Gb/s (SATA0, SATA1, SATA2, SATA3)
2 UART ports COM1/2 with console redirection
4 GPO and 4 GPI with interrupt

Dual channel non-ECC 1600/1333 MHz DDR3L memory up
to 16GB in dual SODIMM socket
Embedded BIOSt
AMI EFI with CMOS backup in 8MB SPI BIOS with Intel®
AMT 9.0 support
L3 Cachet
4MB for i7-4650U, 3MB for i5-4300U and i3-4010U; 2MB for
2980U
Expansion Bussest
4 PCI Express x1: lanes 0/1/2/3
t
LPC bus, SMBus (system), I2C (user)
SEMA Board Controller t Supports : Voltage/Current monitoring, Power sequence
debug support, AT/ATX mode control, Logistics and Forensic
information, Flat Panel Control, General Purpose I2C, Failsafe
BIOS (dual BIOS ), Watchdog Timer and Fan Control
Debug Headerst
40-pin multipurpose flat cable connector
t
Use in combination with DB-40 debug module
t
Providing BIOS POST code LED, BMC access, SPI BIOS
flashing, power testpoints, debug LEDs
t
60-pin XDP header for ICE debug of CPU/Chipset

Super I/O

Video

Mechanical and Environmental

GPU Feature Supportt

Generation 7.5 graphics core architecture, supporting
3 independent and simultaneous display combinations of
DisplayPort/ HDMI/ LVDS monitors
t
Encode/transcode HD content
LVDSt
Single/dual channel 18/24-bit LVDS from eDP (two lanes)
Digital Display Interfacet DDI1 supporting DisplayPort / HDMI / DVI
t
DDI2 supporting DisplayPort / HDMI / DVI

Audio
ChipsettIntel® HD Audio integrated in SOC
Audio Codect
Located on carrier Express-BASE6 (ALC886 standard
supported)

t
On carrier if needed (standard support for
tW83627DHG-P)

TPM (optional)
Chipsett
Typet

Atmel
AT97SC3204
TPM 1.2

Power
Standard Inputt
Wide Inputt
Managementt
Power Statest
ECO mode t

Form Factor t
Dimensiont
Operating Temperaturet
t
Humidityt
t
Shock and Vibrationt
t
HALTt

ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5%
ATX = 5~20 V / 5Vsb ±5% or AT = 5~20V
ACPI 4.0 compliant, Smart Battery support
C1-C6, S0, S1, S4, S3, S5 , S5 ECO mode (Wake on USB
S3/S4, WOL S3/S4/S5)
Supports deep S5 mode for power saving

PICMG COM.0 : Rev 2.1 Type 6
Compact size: 95 mm x 95 mm
Standard: 0°C to +60°C
Extreme Rugged™: -40°C to +85°C (optional)
5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and
Method 214A, Table 214-I, Condition D
Thermal Stress, Vibration Stress, Thermal Shock and
Combined Test

Operating Systems
Standard Supportt
Windows 7/8 32/64-bit, Linux 32/64-bit
Extended Support (BSP)tWES7/8, Linux , VxWorks

http://www.adlinktech.com/Computer-on-Module