Rohde & Schwarz TSVP GOEPEL electronic?s Boundary Scan Integration for Rohde & Schwarz?s Functional / In-Circuit Testers0 pages
Rohde & Schwarz TSVP
GOEPEL electronic’s Boundary Scan Integration for
Rohde & Schwarz’s Functional / In-Circuit Testers
• Ofcially certied system integration between Rohde & Schwarz and
GOEPEL electronic up to 80 MHz
• Reduced xture costs through Boundary Scan embedded in FCT/ICT
• High signal integrity through differential signal transmission via Paddle
Card and TIC 02/SR
• Up to 192 digital channels per slot with optional PXI-DIO modules
from GOEPEL electronic
• Fully automated interaction between DIO test channel and Boundary
Scan based on SYSTEM CASCON™ 4
• Increased test coverage and short test time through integration with
DIO modules
• Extended test access of SYSTEM CASCON through DIO module test channels
• PXI DIO and IVI drivers: DIO test channels are also usable for other TSVP
functions
• Integration of all CASCON functions in the TSVP programming interface