X.Tract0 pages

SEE MORE WITH X.TRACT

X.Tract provides CT-quality inspection results of complex, multilayer electronics assemblies without slicing the board. In a rapid
and user friendly process, it creates virtual microsections in any
direction in the region-of-interest. X.Tract reveals defects that
are obscured in 2D X-ray images of layered components.
The new X.Tract tool provides, fully automated acquisition,
powerful image processing and detailed reporting. With X.Tract,
users gain better insight into complex packages such as Package
on Package (PoP) or dual-layered boards leading to reduced
false call rates and higher productivity.

Benets

View in detail any virtual slice in any direction in an easy non-destructive process

• Identify defects with ease from complex multi-layer boards
• Travel through a component by viewing 2D slices from any
direction, enabling isolated clear views.
• Works for small and large boards and assemblies
• Automated, fast acquisition and view within minutes
• Available on XT V 160 systems

NIKON METROLOGY I VISION BEYOND PRECISION

Flyer X.Tract.indd 1

X.Tract enables to isolate and inspect a component in a complex package

04/11/14 10:56