Low Concentration Zirconia Oxygen Analyzer0 pages

General Model 0X400

Specifications knaiyCzern,ra,ion Zirc°nia °xy9en C €

Analyzer

GS 11M10B01-01E

The OX400 is a highly accurate and reliable low-con-

centration zirconia oxygen analyzer that is capable of

measuring a wide range of concentrations, from 0-10

ppm up to 0-100 vol% 02. This is the latest oxygen

analyzer from Yokogawa, and its development was

based on the company's long experience and strong

track record with this technology.

A proprietary new thin-film deposition technology was

used in the zirconia sensor that creates a molecular

bond between the zirconia element and the platinum

layer. This prevents separation, enables a reduction in

sensor size and ensures a high-speed response and

long life.

The OX400 can be used to control and monitor various

semiconductor applications, and to control environ-

ment, air leakage into inert gas, and other processes.

Features

Long life and high-speed response

• Thanks to the use of Yokogawa's proprietary new

thin-film deposition technology, the sensor has three

times the lifespan of those used in our earlier prod-

ucts.

• A cylindrical sensor design facilitates the replacement

of measurement gases, thereby helping to assure a

high-speed response.

High performance and high reliability

• Superior repeatability and linearity even at low oxy-

gen concentrations

• Either pump or aspirator sampling can be selected,

depending on the application.

• CE, C-tick, cCSAus certification.

Built-in functions and a variety of self-diagnosis

functions

• Comes with multi selector, auto range, partial range,

and pump on/off functions

• A variety of self-diagnosis functions are provided that

detect malfunctions such as heater temperature error,

temperature sensor burnout, and sensor resistance

value error.

Superior maintainability

• The sensor can be replaced on-site.

• Compact and lightweight for easy installation.

Applications

• Oxygen concentration control in semiconductor-relat-

ed diffusion and drying furnaces and in LCD manu-

facturing processes

• Oxygen concentration control in solder pot flow and

re-flow ovens, and glove boxes used in electronics

manufacturing, and in gas production processes

• Oxygen concentration measurements to prevent dust

explosions during powder transfer

« I ^ iii • •« Yokogawa Electric Corporation GS 11M10B01-01E

Yl)Kl)Cji\\A//\ 2-9-32, Nakacho, Musashino-shi, Tokyo, 180-8750 Japan ©Copyright Jun. 2009

1 XV"^ ▼ Tel.: 81-422-52-5617 Fax.: 81-422-52-6792 1st Edition Jun. 2009

3rd Edition Mar. 2011